World Co-Packaged Optics Component and Module-level CPO product Market Developments Report 2022-2030 with a Strong Emphasis on CPO's Impact on the Optoelectronic Supply Chain

December 16, 2022

Dublin, Dec. 16, 2022 (GLOBE NEWSWIRE) -- The "Markets for Co-Packaged Optics 2022-2030" report has been added to's offering. This report examines the latest developments in connectivity, lasers, and cooling systems for CPO as well as showing how CPO modules will be used in four kinds of data center. The report forecasts CPO from 2022 to 2030 with breakouts by type of data center and location (inter-building/inter-machine or rack/server) in the data center. The sales of specialized co-packaged optical components will exceed $1.3 billion in revenues in 2025 and grow to $2.7 billion by 2028. The report analyzes both component and module-level CPO product developments. In this new co-packaged optics market report, we bring the story up to date and focus on advances for CPO in the data center. In the first main chapter we focus on the role of the standards and IAs, especially the latest version of the OIF's CPO Framework. In our view the work recently presented by the OIF will lead to new product directions for laser, transceiver, and switch modules, as well as connectors. While in the past, the drive towards high speeds in the data center has been caused by the growing ubiquity, the data networking now believes that in the future even higher latency traffic, especially AI and machine language (ML) traffic will predominate. These and other newer kinds of traffic are now being cited as what is motivating CPO R&D. The final chapter of this report predicts how large data centers will be rearchitected with CPO to meet current demands. This chapter also includes multi-year forecasts in revenue and volume terms of CPO products for the data center. Along the way this report discusses such matters as how well CPO will compete with the new breed of 800G pluggables and how far it will be able to penetrate the data center market. In addition, the report looks at how the CPO industry sector is evolving, which companies are rising to prominence and how the optical components supply chain is coping with the new challenge of an integrated optoelectronic product. This report has a strong emphasis on CPO's impact on the optoelectronic supply chain in the wake of both technological change and geopolitical developments. Key companies discussed include AMD, Anritsu, Ayar Labs, Broadcom, Furukawa Electric, GlobalFoundries, IBM, Marvell, Lumentum, Ranovus, SENKO, TE Connectivity, Xilinx, and others. From the Report The commercial potential of co-packaged optical components was recently demonstrated, when Senko Advanced Components acquired Cudoform, specifically for access to Cudoform's micro-mirror connector in a CPO application. Other CPO components in immediate demand include cooling systems and external lasers. Intel researchers also recently demonstrated an eight-wavelength silicon laser array that Intel believes can be integrated into a CPO package.Large deployments of CPO systems may not occur until 2027, but CPO module manufacturers are already buying critical co-packaged optical components; a couple of years in advance. CPO components will be the first big opportunity in the coming CPO revolution.Demand for CPO components will spur manufacturing to meet the demanding requirements for tight-spaced packaging and hard-to-integrate photonics. The goal of Intel's research laser array is specifically a high-volume chiplet-product. Among those increasingly focused on CPO are merchant silicon firms, which are leveraging the latest silicon photonics technology to exploit this opportunity Key Topics Covered: Executive SummaryE.1 Objective and Scope Of This ReportE.2 CPO Product TrendsE.3 The OIF Co-Packaging FrameworkE.4 Near-Packaged Optics EmergesE.5 Data Center Markets For CPOE.5.1 CPO In the Hyperscale Data CenterE.5.2 Enterprise Data CentersE.5.3 Telecom Data CentersE.5.4 Edge Data Centers Chapter One: Introduction: The Need for CPO in the Latency-sensitive Data Center1.1 Background to This Report1.1.1 Evolution of CPO in 2021 and Early 20221.1.2 CPO and the Changing Nature of Data Center Traffic1.1.3 Five-year Forecast of CPO Products1.2 Objective and Scope of This Report Chapter Two: Recent Advances in CPO Products and Standards2.1 Origins and Definitions of CPO Technology2.1.1 CPO: Worthy Successors to Silicon Photonics and On-Board Optics2.1.2 A Note on CPO and Chiplets2.2 CPO Product Trends and Recent Developments2.2.1 Ranovus2.2.2 Marvell2.2.3 Anritsu and SENKO2.2.4 Ayar Labs and Lumentum2.2.5 Furukawa Electric2.2.6 Yet Other Firms2.3 Standards and Agreements Related To CPO2.4 The OIF Co-Packaging Framework2.4.1 External Laser Small Form Factor Pluggable Project2.4.2 Cooling Systems for Co-Packaging Co-packaged Engines2.4.3 3.2T Co-Packaged Optics Optical Module2.5 The Role of COBO2.5.1 COBO CPO Working Group2.6 Near-Packaged Optics2.7 Impact of Next-Gen Pluggables2.7.1 The Survivability of Pluggables2.8 Switching Generations And CPO2.9 Fitting CPO Into the Transceiver Supply Chain2.9.1 Multiple Suppliers and Single Suppliers2.10 CODA: Emerging Issues2.11 Key Points from This Chapter Chapter Three: Impact of Latency-Sensitive Traffic on Demand for CPO3.1 New Types of Traffic3.2 Videoconferencing and Online Events: Emerging Requirements3.2.1 How Will the Video Boom Survive COVID-19?3.3 Data Centers, AI and ML3.3.1 Latency and AI3.3.2 Networked AI and CPO3.4 IOT AND IIOT3.5 Other Kinds of Traffic3.6 Key Points from This Chapter Chapter Four: Rebuilding the Data Center with CPO: A Multi-year Projection4.1 Forecasting Philosophy for CPO In the Data Center4.1.1 An Optimistic Scenario for Co-packaged Optics4.1.2 A Pessimistic Scenario for Co-packaged Optics4.1.3 New Thoughts on Pricing4.1.4 Growth of Data Centers4.2 CPO In the Hyperscale Data Center4.2.1 Forecasts of CPO in the Hyperscale Data Center4.2.2 A Note on HPC in the Hyperscale Data Center4.3. Enterprise Data Centers4.3.1 Forecasts of CPO In the Enterprise Data Centers4.4 TELECOM DATA CENTERS4.4.1 Forecasts of CPO in Telecom Data Centers4.5 Edge Data Centers4.5.1 Forecasts of CPO In Edge Data Centers4.6 Summary of Forecasts4.7 A Note on Switches as the Main Driver for High Data Rate Transceivers4.8 CPO May Need Generational Change in The Data Center For A Real Take Off4.9 CPO Components Market4.10 Key Points from This Chapter Companies Mentioned AMDAnritsuAyar LabsBroadcomFurukawa ElectricGlobalFoundriesIBMLumentumMarvellRanovusSENKOTE ConnectivityXilinx For more information about this report visit

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